november 2011 doc id 17536 rev 2 1/9 9 STTH1002C-Y automotive high efficiency ultrafast diode features suited for smps low losses low forward and reverse recovery times high junction temperature low leakage current aec-q101 qualified description dual center tap rectifie r suited for switch mode power supplies and high frequency dc to dc converters. packaged in dpak and d 2 pak, this device is intended for use in low voltage, high frequency inverters, free wheeling and polarity protection for automotive applications. table 1. device summary symbol value i f(av) up to 2 x 8 a v rrm 200 v t j (max) 175 c v f (typ) 0.78 v t rr (typ) 20 ns d 2 pak stth1002cgy a1 a2 k a1 a2 k k dpak stth1002cby k k a1 a2 www.st.com
characteristics STTH1002C-Y 2/9 doc id 17536 rev 2 1 characteristics when the diodes 1 and 2 are used simultaneously: t j (diode1) = p(diode1) x r th(j-c) (per diode) + p(diode2) x r th(c) to evaluate the conduction losses use the following equation: p = 0.73 x i f(av) + 0.032 i f 2 (rms) table 2. absolute ratings (limiting values, per diode) symbol parameter value unit v rrm repetitive peak reverse voltage 200 v i f(rms) forward rms current d 2 pa k 20 a dpak 10 i f(av) avarage forward current = 0.5 t c = 155 c per diode 5 a t c = 150 c per device 10 t c = 135 c per diode 8 t c = 125 c per device 16 i fsm surge non repetitive forward current t p = 10 ms sinusoidal 50 a t stg storage temperature range -65 to + 175 c t j operating junction temperature range -40 to + 175 c table 3. thermal parameters symbol parameter value (max) unit r th(j-c) junction to case per diode 4.0 c/w per device 2.5 r th(j-c) coupling 1.0 table 4. static electrical characteristics (per diode) symbol parameter test conditions min. typ. max. unit i r (1) 1. pulse test: t p = 5 ms, < 2 % reverse leakage current t j = 25 c v r = v rrm 5 a t j = 125 c 3 40 v f (2) 2. pulse test: t p = 380 s, < 2 % forward voltage drop t j = 25 c i f = 5 a 1.1 v t j = 25 c i f = 10 a 1.25 t j = 150 c i f = 5 a 0.78 0.89 t j = 150 c i f = 10 a 1.05
STTH1002C-Y characteristics doc id 17536 rev 2 3/9 table 5. dynamic electrical characteristics symbol parameter test cond itions min. typ. max. unit t rr reverse recovery time t j = 25 c i f = 1 a v r = 30 v di f /dt = 100 a/s 20 25 ns i rm reverse recovery current t j = 125 c i f = 5 a v r = 160 v di f /dt = 200 a/s 5.9 7.6 a t fr forward recovery time t j = 25 c i f = 5 a di f /dt = 100 a/s v fr = 1.1 x v fmax 110 ns v fp forward recovery voltage t j = 25 c i f = 5 a di f /dt = 100 a/s 2.4 v
characteristics STTH1002C-Y 4/9 doc id 17536 rev 2 figure 1. peak current versus duty cycle (per diode) figure 2. forward voltage drop versus forward current (typical values, per diode) i (a) m 0 10 20 30 40 50 60 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 t =tp/t tp i m p = 10w p = 5w p = 2w 0 10 20 30 40 50 60 70 80 90 100 0.00 0.25 0.50 0.75 1.00 1.25 1.50 1.75 2.00 2.25 2.50 2.75 3.00 v (v) fm i (a) fm t =25c j t =150c j figure 3. forward voltage drop versus forward current (maximum values, per diode) figure 4. relative variation of thermal impedance junction to case versus pulse duration i (a) fm 0 10 20 30 40 50 60 70 80 90 100 0.00 0.25 0.50 0.75 1.00 1.25 1.50 1.75 2.00 2.25 2.50 2.75 3.00 t =150c j t =25c j v (v) fm z/r th(j-c) th(j-c) 0.1 1.0 1.e-03 1.e-02 1.e-01 1.e+00 single pulse t (s) p figure 5. junction capacitance versus reverse voltage applied (typical values, per diode) figure 6. reverse recovery charges versus di f /dt (typical values, per diode) 10 100 0 50 100 150 200 c(pf) v (v) r f=1mhz v =30mv t =25c osc rms j q (nc) rr 0 20 40 60 80 100 120 140 160 180 200 220 240 10 100 1000 di /dt(a/s) f i =5a f v =160v r t =25c j t =125c j
STTH1002C-Y characteristics doc id 17536 rev 2 5/9 figure 11. thermal resistance junction to ambient versus copper surface under tab (epoxy printed circuit board fr4, copper thickness = 35 m) for dpak figure 7. reverse recovery time versus di f /dt (typical values, per diode) figure 8. peak reverse recovery current versus di f /dt (typical values, per diode) t (ns) rr 0 10 20 30 40 50 60 70 80 10 100 1000 di /dt(a/s) f i =5a f v =160v r t =25c j t =125c j i (a) rm 0 1 2 3 4 5 6 7 8 9 10 11 12 13 10 100 1000 di /dt(a/s) f i =5a f v =160v r t =25c j t =125c j figure 9. dynamic parameters versus junction temperature figure 10. thermal resistance junction to ambient versus copper surface under tab for d 2 pak i rm q rr 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 25 50 75 100 125 150 t (c) j q; rr i [t ]/q ;i [t =125c] rm j rr rm j i =5a f v =160v r 0 10 20 30 40 50 60 70 80 02468101214161820 s(cu)(cm2) r (c/w) th(j-a) epoxy printed circuit board fr4, copper thickness = 35 m 0 10 20 30 40 50 60 70 80 90 100 0 2 4 6 8 10 12 14 16 18 20 r (c/w) th(j-a) s(cu)(cm2)
package mechanical data STTH1002C-Y 6/9 doc id 17536 rev 2 2 package mechanical data epoxy meets ul94, v0 cooling method: by conduction (method c) in order to meet environmental requirements, st offers these devices in different grades of ecopack ? packages, depending on their level of environmental compliance. ecopack ? specifications, grade definitions and product status are available at: www.st.com . ecopack ? is an st trademark. figure 12. footprint (dimensions in mm) table 6. dpak dimensions ref. dimensions millimeters inches min. max. min. max. a 2.20 2.40 0.086 0.094 a1 0.90 1.10 0.035 0.043 a2 0.03 0.23 0.001 0.009 b 0.64 0.90 0.025 0.035 b2 5.20 5.40 0.204 0.212 c 0.45 0.60 0.017 0.023 c2 0.48 0.60 0.018 0.023 d 6.00 6.20 0.236 0.244 e 6.40 6.60 0.251 0.259 g 4.40 4.60 0.173 0.181 h 9.35 10.10 0.368 0.397 l2 0.80 typ. 0.031 typ. l4 0.60 1.00 0.023 0.039 v2 0 8 0 8 h l4 g b l2 e b2 d a1 r r c a c2 0.60 min. v2 a2 6.7 6.7 3 3 1.6 1.6 2.3 2.3
STTH1002C-Y package mechanical data doc id 17536 rev 2 7/9 figure 13. footprint (dimensions in mm) table 7. d 2 pak dimensions ref. dimensions millimeters inches min. max. min. max. a 4.40 4.60 0.173 0.181 a1 2.49 2.69 0.098 0.106 a2 0.03 0.23 0.001 0.009 b 0.70 0.93 0.027 0.037 b2 1.14 1.70 0.045 0.067 c 0.45 0.60 0.017 0.024 c2 1.23 1.36 0.048 0.054 d 8.95 9.35 0.352 0.368 e 10.00 10.40 0.393 0.409 g 4.88 5.28 0.192 0.208 l 15.00 15.85 0.590 0.624 l2 1.27 1.40 0.050 0.055 l3 1.40 1.75 0.055 0.069 m 2.40 3.20 0.094 0.126 r 0.40 typ. 0.016 typ. v2 0 8 0 8 g l l3 l2 b b2 e * flat zone no less than 2m m a c2 d r a2 m v2 c a1 * 16.90 10.30 8.90 3.70 5.08 1.30
ordering information STTH1002C-Y 8/9 doc id 17536 rev 2 3 ordering information 4 revision history table 8. ordering information order code marking package weight base qty delivery mode stth1002cby-tr stth1002cy dpak 0.3 g 2500 tape and reel stth1002cgy-tr stth1002cgy d 2 pak 1.48 g 1000 table 9. document revision history date revision changes 21-oct-2010 1 first issue. 03-nov-2011 2 updated ta b l e 7 and table 8.
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